Application technologies

Thanks to our great know-how that has been formed over the years with experience and advanced specialized courses, Life Elettronica is now capable of top level performance.

Top performance in the following applications:

– Balling MLO (multilayer organic)
– RE-balling BGA
– Bonding
– Flex, SemiFlex, Rigid Flex, Rigid (thickness 0,2mm up to 7mm)
– MotherBoard (up to 685*585)
– IMS
– PoP
– Underfill
– Vapor Phase soldering
– Selective Soldering
– 6 axis resin machine
– Xray3D for process control and complex analysis
– Board washing