LIFE ELETTRONICA TECHNOLOGY PROFILE
GENERAL INFO
RoHS and NON RoHS capability
SMT and THT areas under temperature and humidity control
ElectroStatic and Moisture Sensitivity Management
Automatic magazine for reel, tube and tray under moisture control.
SMT ASSEMBLY CAPACITY
MAX. ASSEMBLY CAPABILITY 400 milion of components per year
MIN. COMPONENT DIMENSION 01005, BGA, LGA, QFN fine-pitch (0,2 mm)
MAX. COMPONENT DIMENSION 180 mm x 32 mm OR 75mm x 75mm, H25.4
MAX. BOARD DIMENSION 680 mm x 580 mm
SOLDERING nitrogen atmosphere with real time profiling; Vapor Phase Soldering
TRACIABILITY: each component
THT ASSEMBLY CAPACITY
COMPONENTS PREPARATION automatic / semi-automatic
MAX. BOARD DIMENSION 540 mm x 450 mm
SOLDERING wave and selective (2 POT), nitrogen atmosphere
PROCESS CONTROL
SCREEN PRINTER SETUP CONTROL
SPI3D IN LINE 100% AREA, VOLUME AND HEIGHT
3D-AOI INSPECTION 100%, solder joints and components placement
X-RAY 3D INSPECTION for BGA and non-visible characteristics
TESTING, AGEING, SAFETY
ICT FLYING PROBES with power-on features
ICT BED OF NAILS with power-on and integrated programming functionalities
AUTOMATIC FUNCTIONAL with National LabView®-based platforms
SEMI-AUTOMATIC FUNCTIONAL with customized simulation tools
AGEING burn-in and run-in climatic chambers
SAFETY hi-voltage, insulation, ground protection, leakage current
SPECIAL APPLICATION
COATING: In line with acrylic and siliconic tropicalization
RESIN: Automatic 6 axis machine
BALLING & RE-BALLING: 400 Micron or bigger balls.
BONDING: Wire bonding application
PoP: Package on package application
SPECIAL PCB: Flex, semi-flex, rigid-flex, rigid (from 0,2mm to 8mm)
UNDERFILL: Underfill BGA application.